Chair:  Dave McCarron, Dell, Inc.

The 2002 iNEMI Roadmap highlighted the need for requirements, processes and standards to help the electronics industry address the many supply chain issues surrounding the transition to Pb-free assembly and, more specifically, the requirements of the RoHS and WEEE directives.  In late 2003, iNEMI created the RoHS Transition Task Group to further define areas for standardization and to develop implementation projects.  The following projects resulted from this effort.  All were completed in 2004-2005.

          Assembly Process Specifications
          Component and Board Marking
          Component Supply Chain Readiness
          Materials Declarations

Presentations

NEMI RoHS/Pb-Free Summit (October 18-20, 2004; Louisville, CO)

NEMI Material Data Exchange Coordination Meeting (September 9, 2004; Berlin, Germany)

Material Declaration Data Exchange Workshop (August 30-31, 2004; Santa Clara, CA)

The Transition to Pb-free Products, Galen J. Reeder (Delphi Corporation), Dave McCarron (Dell), Robert C. Pfahl, Jr. (NEMI), Second International Conference on Lead Free Electronics, June 21-23, 2004 (Amsterdam).

APEX 2004 presentations

Other resources

COMMISSION DECISION of 18 August 2005 amending Directive 2002/95/EC of the European Parliament and of the Council for the purpose of establishing the maximum concentration values for certain hazardous substances in electrical and electronic equipment. (PDF) (Refer to the Commission FAQs for the definition of "homogeneous material.")

JOINT INDUSTRY GUIDE for Material Composition Declaration of Electronics Product (final). This guide, from EIA (Electronic Industries Alliance), JGPSSI (Japan Green Procurement Survey Standardization Initiative) and JEDEC, establishes the materials and substances that must be disclosed by suppliers to meet RoHS requirements.

Department of Trade and Industry (DTI) -- Sustainable Development and Environment (UK)

Europa -- RoHS

Europa -- WEEE

EMSF Guidelines rev 1.1 (abbreviated for parts ID discussion)

EMSF Guidelines for PCB Suppliers Transitioning to Lead-Free Solder (updated December 2003) (PDF)  

Participants

Agilent Technologies, Inc. Boeing Satellite Systems, Inc. Bourns, Inc. Celestica, Inc. Cookson Electronics Dell, Inc. Electronic Industries Alliance (EIA) EMC Corporation Environmental Monitoring and      Technologies, Inc. (EMT) The GoodBye Chain Group, LLC HP Honeywell Aerospace Electronic Systems IBM Corporation Intel Corporation Intersil Corporation Jabil Circuit, Inc. Lexmark International, Inc.

Loctite Electronics Lucent Technologies Motorola, Inc. Nokia NSWC Crane (US Navy) Philips Plexus Corp. RosettaNet Raytheon Company Sanmina-SCI Corporation Solectron Corporation Shure Incorporated Soldertec at Tin Technology Ltd. StorageTek Sun Microsystems, Inc. Tyco Electronics U.S. Army Aviation and Missile      Command, Redstone Arsenal