Projects

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Environmentally Conscious Electronics (ECE) TIG

Active projects:
  - HFR-Free High-Reliability PCB (formerly BFR-Free; joint with the Substrates TIG)
  - High-Reliability RoHS Task Force
  - Pb-Free Rework Optimization 
  - Pb-Free Wave Soldering

New initiatives:
  - HFR-Free Leadership Program
    - HFR-Free Leadership PCB Material
    - HFR-Free Signal Integrity
  - PVC Alternatives
  - Eco-Impact Evaluator for ICT Equipment
  - Tin Whisker Project, Phase 2

Completed projects:
  - HFR-Free PCB: Design Phase (formerly BFR-Free; joint with the Substrates TIG)
  - HFR-Free PCB Material Evaluation (formerly BFR-Free; joint with the Substrates TIG)
  - Lead-Free Assembly
  - Lead-Free Assembly & Rework 
  - RoHS Transition Task Group 
    - Assembly Process Specifications
    - Component and Board Marking
    - Component Supply Chain Readiness
    - Materials Declarations
  - Tin Whisker Accelerated Test
  - Tin Whisker Modeling
  - Tin Whisker User Group