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iNEMI » cms » projects » heattransfer » Teleconference_Impact_of_Liquid_Cooling_January_2006.html
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Projects
Liquid Cooling Project Meeting Thursday, March 2, 11:00 a.m. EST The iNEMI Heat Transfer Technology Integration Group (TIG) will hold a project meeting teleconference on March 2 at 11:00 a.m. EST. Background The Heat Transfer TIG has developed a list of projects based on membership input and the 2006 Heat Transfer Technical Plan. The group started with six potential areas of interest and decided to concentrate their efforts in two areas: impact of liquid cooling and 3D packaging (best known methods). This meeting will focus on the liquid cooling project. Scope This group proposes to limit its work to "in the product" liquid cooling and will not cover the interface between the electronic product and the environment as other groups (notably ASHRAE), are currently working this issue. The iNEMI initiative proposes to look at an overall systems approach, including hot side heat exchanger, pump or fluid driving device, and tubing or fluid path. These components represent the greatest challenge to commercialization of liquid cooling. Areas such as reliability, system life, manufacturability and cost will all be considered. Dial-in information Toll-free number: +1 888-231-5467 Toll number: +1 719-955-1389 Passcode: 113998 This teleconference is open to non-members and we welcome anyone interested in participating.
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