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Optoelectronics TIG


New program:
iNEMI Optical Device Inspection & Cleaning Program
This program is continuation of the iNEMI project “Fiber Optic Connector End-Face Inspection, Phase 2.”  The program will be focused on the research in the following three project areas:
1. Investigate Impact of Connector Particle Thickness
2. Investigate Impact of Contamination and Scratches on 40G Optical Signal Transmission
   a. Phase 1 - Investigate Impact of Contamination and Polishing Scratches on 40G Optical Link Performance
   b. Phase 2 - Develop Recommendations on Connector End-Face Cleanliness Inspection Criteria for 40G Optical Signal Transmission
3. Develop Receptacle Lens Cleanliness Inspection Criteria
   a. Phase 1 - Modeling & Experimental Investigation of Receptacle Lens Cleanliness Inspection Criteria
   b. Phase 2 - Development of Inspection Criteria for Contamination on Lens-Based Modules

New projects:
iNEMI Optical Device Inpsection & Cleaning Program
     iNEMI Connector Particle Thickness Investigation Project, Phase 1
    
Completed projects:
- Fiber Optic Splice Loss Measurement
- Optoelectronics for Substrates (joint with the Substrates TIG)
- Fiber Connector End-Face Inspection, Phase 2
            End of Project Webinar, Phase 2 (March 23, 2009)
- Fiber Connector End-Face Inspection, Phase 1
           End of Project Webinar, January 24, 2007

Fiber Optic Signal Performance
- Fiber Optic Splice Improvement
- Fiber Handling