• Develop and promote the adoption of chip BIST at the board/system level
• Encourage IC vendors to provide standard chip BIST interfaces and algorithms.
• Encourage ATE/instrument suppliers (board-level manufacturing) to adopt and develop products based on chip BIST.

Work will be implemented in three phases:

Phase 1 -- The first phase will survey the industry regarding current BIST capabilities and future requirements. The goal of this phase is to get industry feedback on board-level BIST that will assist in fine tuning the scope of Phase 2 of the project.

Phase 2 -- The current vision is that the second phase will include the following:

• Identify chip BIST technologies that can be migrated to run at board/system-level test.
• Investigate BIST tests that enable PCBA testing without (or with only minimal use of) fixture/ICT (in-circuit test), currently the typical manufacturing test approach. The objective is to lower the cost of test and enhance test coverage for high-speed interconnects.
• Promote extension of existing related standards to include BIST design.

Phase 3 -- The third phase will develop guidelines and recommendations for a new standard for PCBAs to run BIST tests, and transfer these recommendations to the appropriate standards body for implementation. (Phase 3 will take place only if it is a recommended outcome of Phase 2.)