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Board Flexure Standardization Project, Phase 2
Guidelines for Printed Wiring Board Strain Gage Testing in Pb-Free Assemblies


Click here for telecon information

Project objective
To develop recommendations to update IPC/JEDEC 9704 to reflect current best practices in strain gage technologies and measurement techniques.

Steps for joining the project
On July 19, 2010, the iNEMI Technical Committee approved the SOW and Project Statement, thus beginning the corporate sign-up period for this project.  The project will officially begin as soon as two iNEMI members sign the project statement. The period for becoming a founding member for this project will close on September 10, 2010.

      For iNEMI members:

  • Complete and sign the project statement
  • Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to infohelp@inemi.org

      For non-members:

Statement of Work and Project Statement (PDF files)

Statement of Work (Version 2.1; July 19, 2010)

Project Statement (Version 2.1; July 19, 2010) (initial sign up ends September 10, 2010)


Click here for information on Board Flexure Standardization Project - Phase 1


For additional information
David Godlewski
+1 717-651-0522
dgodlewski@inemi.org