Roadmap
Roadmapping efforts are coordinated by Chuck Richardson, iNEMI's Director of Roadmapping. The iNEMI Roadmap is created by volunteers from the electronics industry (iNEMI members and non-members) who form groups and committees to develop chapters, presently for 6 Product Emulator Groups (PEGs), which cover product sectors, and 21 Technology Working Groups (TWGs), which cover technology and business/infrastructure areas.
Each chapter anticipates manufacturing technology needs over a 10-year horizon. Each of the PEGs has a chair or co-chairs and as many group members as needed for a broad-based view of that emulator's scope (usually 2-5 individuals).
2011 iNEMI Roadmap Product Emulator Groups (PEGs):
| 1. Aerospace / Defense |
4. Medical |
| 2. Automotive |
5. Netcom (Network, Datacom, telecom) |
| 3. Consumer / Portable |
6. Office / Large Business Systems |
The PEGs define OEM requirements for their product sectors from both a business and technology perspective. These needs are presented in each PEG chapter, using key attribute tables and text according to templates that are furnished by the iNEMI Technical Committee. Each PEG chair will be expected to attend two to three face-to-face meetings during the 2009/2010 calendar years, but most of the group's work is done by telephone and over the web.
The TWGs use the OEM requirements detailed in the 6 PEG chapters to prepare each of their roadmap chapters, detailing where their respective technology stands today - and is expected to progress over the next 10 years - with respect to the stated needs. Other than the TWG chairs, who are expected to attend a minimum of three meetings, no travel is required to participate in a TWG, and this activity requires only as many hours as you want to dedicate to it, depending upon how involved you wish to be.
2011 iNEMI Roadmap Technology Working Groups (TWGs):
|
1. Board Assembly
2. Electronic Connectors
3. Energy Storage and Conversion
Systems
4. Environmentally Conscious
Electronics
5. Final Assembly
6. Information Management (IM)
7. Interconnect PCB - Organic
8. Interconnect Substrates - Ceramic
9. Large-Area Flexible Electronics
10. Mass Data Storage
11. MEMS/Sensors |
12. Modeling, Simulation & Design
Tools
13. Optoelectronics
14. Packaging & Component
Substrates
15. Passive Components
16. Photovoltaics
17. RF Components & Subsystems
18. Semiconductor Technology
19. Solid State Illumination
20. Test, Inspection & Measurement
21. Thermal Management |
Changes from 2009 Roadmap to 2011 Roadmap
We have made a few changes to the TWG names and responsibilities as follows:
1. The “Packaging” TWG has been changed to “Packaging & Component Substrates.”
2. The “Sensors” TWG has been changed to “MEMS/Sensors” to reflect the growing importance of MEMS (Micro-Electro-Mechanical Systems) to the electronics industry and the new focus on MEMS in this TWG.