Roadmap
Roadmapping efforts are coordinated by Chuck Richardson, Staff Manager of Roadmapping, and iNEMI’s Director of Roadmapping. The iNEMI Roadmap is created by volunteers from the electronics industry (iNEMI members and non-members) who form groups and committees to develop chapters, presently for 5 Product Emulator Groups (PEGs) and 19 technology and business/infrastructure areas. Each chapter anticipates manufacturing technology needs over a 10-year horizon. Each of the PEGs has a chair or co-chairs and as many group members as needed for a broad-based view of that emulator's scope (usually 2-5 individuals).
2007 iNEMI Roadmap Product Emulator Groups (PEGs):
| 1. Aerospace/Defense |
4. Medical |
| 2. Automotive |
5. Office / Large Business / Communication Systems |
| 3. Consumer / Portable |
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The PEGs define OEM requirements for their product sectors from both a business and technology perspective. Needs are presented in each PEG chapter, using key attribute tables and text according to templates that are furnished by the iNEMI Technical Committee. Each PEG chair will be expected to attend two to three face-to-face meetings during the 2006 calendar year, but most of the group's work is done by telephone and over the Internet.
The Technology Working Groups (TWGs) use the OEM requirements detailed in the 5 PEG chapters to prepare each of their roadmap chapters, detailing where they stand — and expect to progress over the next 10 years — with respect to the stated needs. Other than the TWG chairs, who are expected to attend a minimum of three meetings, no travel is required to participate in a TWG, and this activity requires only as many hours as you want to dedicate to it, depending upon how involved you wish to be.
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2007 iNEMI Roadmap Technology Working Groups (TWGs):
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1. Board Assembly
2. Connectors
3. Energy Storage Systems
4. Environmentally Conscious Electronics
5. Final Assembly
6. Interconnect Substrates - Ceramic
7. Interconnect Substrates - Organic
8. Mass Data Storage
9. Modeling, Simulation & Design Tools
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10. Optoelectronics
11. Organic and Printed Electronics
Technology (new for 2007)
12. Packaging
13. Passive Components
14. PLIM (Product Lifecycle Information
Management)
15. RF Components & Subsystems
16. Semiconductor Technology
17. Sensors
18. Test, Inspection & Measurement
19. Thermal Management
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