Roadmap
Director of Roadmapping: James N. (Jim) Arnold, Motorola, Inc.
Staff Manager of Roadmapping: Charles E. (Chuck) Richardson, NEMI Secretariat
Product Emulator Groups (PEGS) - A product emulator is defined as an abstract representation of a product that will allow companies to share needs without sharing proprietary product information. The 2004 Roadmap cycle will include seven product emulator chapters, and each chapter will set OEM requirements over the next 10 years.
Technology Working Groups (TWGs) - These groups are responsible for developing the individual roadmap chapters that cover the 18 technology and infrastructure areas comprising NEMI's overall industry roadmap. Although the TWGs are usually chaired by NEMI members, participation is open to industry.
Product Emulator Groups
Aerospace/Defense
Bill Murphy (Lockheed Martin), Chair
Automotive
Jim Spall (Delphi Electronics), Chair
Consumer/Portable Products
Susan Noe (3M), Chair
Medical
Anthony Primavera (Guidant)
Terry Dishongh (Intel Corporation), Chair
Netcom (Network Data, Telecom)
Open, Chair
Office/Large Business Systems
Erich Klink (IBM Corporation), Chair
Tom Pearson (Intel Corporation), Co-chair
Technology Working Groups (TWGs)
Board Assembly
Kirk Van Dreel (Plexus Corp.), Co-chair
Dennis Krizman (Celestica, Inc.), Co-chair
Connectors
John MacWilliams (consultant), Chair
Digital Silicon Technology
Paolo Gargini (Intel Corporation), Chair
Alan Allan (Intel Corporation), Co-chair
Displays
M. Robert Pinnel (U.S. Display Consortium), Chair
J. Norman Bardsley (U.S. Display Consortium), Co-chair
Energy Storage Systems
Dan Doughty (Sandia National Laboratories), Chair
Ralph Brodd (Broddarp), Co-chair
Environmentally Conscious Electronics
Mark Newton (Dell Inc.), Chair
Joe Johnson (Microsoft), Co-chair
Final Assembly
J. Michael (Mike) Reagin (Delphi Electronics), Chair
Reijo Tuokko (Tampere University), Co-chair
Interconnect Substrates - Ceramic
Howard Imhof (Metalor Technologies), Chair
Interconnect Substrates - Organic
John T. (Jack) Fisher (consultant), Chair
Dieter Bergman (IPC), Co-chair
Mass Data Storage
Tom Coughlin (Coughlin Associates), Chair
Roger F. Hoyt (consultant), Co-chair
Modeling, Simulation & Design Tools
Sanjeev Sathe (EIT), Chair
Optoelectronics
John W. Stafford (JWS Consulting P.L.C.), Chair
Laura Turbini (Centre for Microelectronics Assembly and Packaging), Co-chair
Packaging
Joseph Adam (Skyworks Solutions), Chair
Bill Bottoms (3MT Solutions), Co-chair
Passive Components
Phillip Lessner (Kemet), Co-chair
Joe Dougherty (Penn State University), Co-chair
Product Lifecycle Information Management
Peter Peloquin (Intel), Chair
Barbara L.M. Goldstein (NIST), Co-chair
Steve Qually (Intel), Co-chair
RF Components & Subsystems
Open, Chair
John Barr (Agilent), Co-chair
Steve Kenney (Georgia Institute of Technology), Co-chair
Sensors
Mike Azarian (CALCE), Co-chair
Gans Ganesan (CALCE), Co-chair
Test, Inspection & Measurement
Michael J. Smith (Teradyne, Inc.), Chair
Thermal Management
Tom Roth (3M), Co-chair
Cam Murray (3M), Co-chair