Newsletters
MEMBER NEWSLETTER
OCTOBER 2008
NEW iNEMI MEMBERWe would like to welcome Elite Material Co., Ltd. as a new member of iNEMI. The first representative is Yih-Rern Peng (+886-3-483-7937 ext 384, yrpeng@mail.emctw.com), and the alternate representative is Li Ming Chou (+886 3-483-7937 ext 285, lm@mail.emctw.com). Elite Material Co., Ltd. is a producer of copper clad laminates for use in multilayer printed circuit boards. Welcome to iNEMI!
RESULTS FROM FALL MEETINGSiNEMI Sustainability SummitThis summit was held on September 22-23 at Motorola's Galvin Center, Schaumburg campus. This summit featured 25 speakers reviewing the current situation and opportunities for environmental change, followed by break-out groups to identify and prioritize specific actions the electronics industry should take.
All presentations are available at
http://www.inemi.org/cms/newsroom/Presentations/Sustainability_2008.html.
In addition, video interviews with a number of the speakers are available at
http://realtimewith.com/pages/show.cgi?rtwsid=14. Click on the iNEMI tab to watch the interviews.
Following the 25 presentations, two break-out groups brainstormed options and priorities:
* The Reuse, Recycling Group, chaired by Alan Rae of NanoDynamics
* The Sustainability Group, chaired by Marc Benowitz of Alcatel-Lucent
Four proposed projects have emerged from the discussions. These proposals have been reviewed, and are supported, by the iNEMI Board of Directors:
1. Non-Competitive LCAs for ICT Products based on a building block approach using assembly emulators/evaluators for weight and class, number of devices by class; agreed upon by industry
2. PVC Replacement Alternatives
a. LCA comparing PVC versus PVC-free cables
b. Technical evaluation of alternatives
3. Establish market for post-consumer plastics as feedstock for "green" products (e.g., polycarbonate, ABS)
4. Establish new electronic applications for post-consumer blended plastics (e.g., housings for power supplies)
The next step is to organize teams to develop interest and plans in each of the four areas. Marc Benowitz has already volunteered to Champion the Non-Competitive LCAs for ICT Products Proposal. Please notify Bob Pfahl (bob.pfahl@inemi.org) if you are interested in participating in or championing one of the four proposed projects.
iNEMI Council of Members Briefing/ReceptionDirectly after the Sustainability Summit at Motorola, iNEMI members gathered for a reception and briefing on our 2008 achievements. Jim McElroy began by going over some of the highlights for Q1-Q3 of this year. Key points included:
* 2009 Roadmap Workshops held in Asia, Europe, and North America
* 21 active projects, including 6 that were launched this quarter
* 3 successful industry forums held (with 1 more planned for November)
* iNEMI position papers
* 11 new members so far this year (ASSET InterTech, Inc.; Corelis; Dell, Inc.; Doosan Corp. Electro Materials BG; Elite Material Co., Ltd.; IHS; Industrial Technology Research Institute (ITRI); IST-Integrated Service Technology, Inc.; ITEQ Corporation; Nan Ya Plastics Corporation; and Test Research, Inc.)
* 12 individuals recognized for their contributions to iNEMI (Suk Jun Kim, Purdue; John Koppes, Purdue; Anthony Muza, Purdue; Prasanna Kulkarni, Motorola; Jie Zhang, Motorola; Andreas Schaller, Motorola, Andrew Skipor, Motorola; Steven Tisdale, Intel; Hope Chik, Motorola; Bill Ballard, 3M; Dan Gamota, Motorola; and Cynthia Williams, iNEMI). Recipients were congratulated by iNEMI Board members Marc Benowitz and Mike Toben. Motorola recipients were congratulated by Bob Pfahl.
We hope all of you that participated enjoyed the event as we recognized our contributors and networked with other members.
DEPLOYMENTSign up for the Board & Systems Manufacturing Test TIG Meeting at ITCiNEMI's Board & Systems Manufacturing Test TIG and and the three test projects have scheduled a meeting on Thursday, October 30, in conjunction with the
International Test Conference (ITC) held at the Santa Clara Conference Center October 28-30, 2008 (Santa Clara, California). The iNEMI meetings will be held in Room 211.
Session Agenda:
9:00 - 10:30 am TIG Meeting (open to industry participation)
10:30 am - noon Board Flexure Standardization Project Meeting
1:00 - 2:30 pm Boundary Scan Adoption Project Meeting
2:30 - 4:00 pm Functional Test Coverage Assessment Project Meeting
The TIG meeting is open to industry while project meetings are by invitation only. Registration is required.
Click here to register for the session and for additional meeting details.
Medical TIG Forum Scheduled at FDA November 14The Medical TIG will hold an open industry forum on Friday, November 14 from 9:30 am to 3:30 pm. The forum is being hosted by the U.S. Food and Drug Administration (FDA) at their White Oak Campus, 10903 New Hampshire Avenue, Silver Spring, Maryland 20903, in Building 2, Room F2047E.
The goal of the forum is to present to the industry the TIG's process for the establishment of a minimum set of requirements for electronics components for application in life critical applications developed in the TIG's Medical Components Reliability Project Review Project. In addition, there will be a review of the TIG's validation process, being demonstrated in the Medical Reliability for MLCC Project, which is determining accelerated life test methods of long-term leakage and breakdown failures of Multi-Layer Ceramic Capacitors (MLCCs).
Click here for a detailed forum agenda and additional logistics information.
Medical Components Reliability Specifications End-of-Project WebinarThursday, November 6 at noon ESTThis webinar will discuss Phase I results. This group's goal was to leverage industry knowledge to create a minimum set of requirements for electronics components for application in life critical applications. To this end, the group established a set of recommendations and standards that the electronics community would embrace for electronic medical products. Specific deliverables include:
* Test and Extrapolation Methodologies
* Sampling Population Assessment
* Range and Conditions of Applicability
* Test Methodologies and Criteria
* Medical Grade Guidelines
* FMEA of MLCC Failures
* Use Conditions for Life Critical Medical Components
* Review of Existing and Related Standards and Test Methods
Click here for additional information about this end-of-project webinar.
2009 iNEMI ROADMAPThe 2009 Roadmap cycle is winding down toward the December publication date for iNEMI members. The chapter chairs are frantically working to get their committees' final inputs and do their final editing and executive summary writing to complete the chapters for staff editing and final formatting. This is the perfect time to sincerely thank all of the PEG/TWG Chairs and their committee members who worked tirelessly on this cycle's roadmap. We know that it is not easy to find "spare time" to put into a second job when your "real job" is as demanding as everyone's in this industry is. We would also like to thank the iNEMI Technical Committee for their insightful direction, comments and reviews of the chapters during the entire cycle. With all of the hard work from everyone involved, we expect this to be one of the best roadmaps yet published.
We will have 20 TWG chapters and 5 PEG chapters this cycle. At this point, we expect to meet the December date for shipping copies of the 2009 iNEMI Roadmap to members. The final listing of chapters follows:
2009 iNEMI Roadmap Product Emulator Groups (PEGs):
1. Automotive
2. Consumer/Portable
3. Medical
4. Netcom (Network, Datacom & Telecom)
5. Office/Large Business Systems
2009 iNEMI Roadmap Technology Working Groups (TWGs):
1. Board Assembly
2. Connectors
3. Environmentally Conscious Electronics
4. Final Assembly
5. Interconnect Substrates - Ceramic
6. Interconnect PCB - Organic
7. Mass Data Storage
8. Modeling, Simulation & Design Tools
9. Optoelectronics
10. Large Area, Flexible Electronics
11. Packaging
12. Passive Components
13. Photovoltaics
14. Information Management
15. RF Components & Subsystems
16. RFID Item-Level Tag
17. Semiconductor Technology
18. Solid State Illumination
19. Test, Inspection & Measurement
20. Thermal Management
iNEMI EUROPEElectronics Goes Green 2008+Bob Pfahl and Grace O'Malley (iNEMI) participated in the Electronics Goes Green conference September 7-10 in Berlin. They made a presentation on "Future Initiatives for Sustainability" as part of a session called Creativity for Future Technologies. (
Download paper . . .
download presentation.)
Carol Handwerker (Purdue University), Co-chair of the iNEMI Research Committee, presented a paper entitled "Nanoparticle Enabled Printing of Green Large-Area Electronic Systems."
During the conference Bob and Grace met with a number of members and potential members to gain their views on environmental issues.
iNEMI ASIAiNEMI to Host Reception for Members in Penang, Malaysia following the IEMT ConferenceNovember 6, 2008 Penang, Malaysia; Park Royal Hotel (tentative start time: 7:00 p.m.)
iNEMI will hold a reception for members following the conference where two iNEMI projects will be presented. Jim McElroy, CEO of iNEMI, will give a brief presentation on iNEMI and Dr. Haley Fu, Manager of Asian Operations, will discuss iNEMI activities in Asia. The goal of the meeting is to increase networking among iNEMI members in Malaysia.
Click here for additional details and to register.
iNEMI to Sponsor Intel Symposium on Environmentally Friendly MaterialsNovember 11-12, Shanghai, China
The symposium will address ongoing discussions about the elimination of brominated flame retardants (BFRs), chlorinated flame retardants (CFRs) and PVC from electronic products, and the impact this will have on the electronics manufacturing supply chain. The main goals of the symposium are to provide a forum to discuss concerns about BFR/CFR/PVC free materials, identify opportunities to address these concerns, and continue the process of industry alignment on common solutions to implement these materials.
Through October 24, the registration fee is 265 USD / 1,800 RMB. After October 24, it is 350 USD / 2,400 RMB. This fee can be paid by credit card or wire transfer. For additional details about the symposium and to register, go to:
http://www.inemi.org/cms/calendar/Intel_Environmental_Materials.html iNEMI LEADERSHIPBob Pfahl, iNEMI Vice President of Global Operations, received the Electronics Goes Green 2008+ award in Berlin for "his commitment to environmental protection and inspiring ideas concerning sustainable development in technology and business solutions."
IN THE NEWSiConnect 007 conducted several video interviews in conjunction with iNEMI's Sustainability Summit. These can be seen on the
PCB 007 website at
http://realtimewith.com/pages/show.cgi?rtwsid=14. (Click on the iNEMI tab to watch the interviews.) Following is a list of interviews and topics discussed:
Understanding the Legal and Market Drivers in Green Electronics
Holly Evans, Strategic Counsel
Working With Industry, Not Against
Dr. Lauren Heine, Clean Production Action
Sustainability, A True Balancing Act
Mike Toben, Rohm & Haas
Sustainability Summit Wrap-Up
Jim McElroy & Bob Pfahl, iNEMI
Sustainability for Small and Medium Manufacturers
Bill Hoffman, Chicago Manufacturing Center
Reuse, Recycling and End-of-Life Wrap-Up
Alan Rae, NanoDynamics
Recycling in a Nutshell
Amanda Hale, Sims Recycling Solutions
Lifecycle Aspects of Nanotechnology
Tom Theis, University of Illinois at Chicago
EPA's End-of-Life and Sustainability Programs
Chris Newman, U.S. EPA
ICT and the Environment
Todd Brady, Intel
Sustainability Must Be Relative
Brad Allenby, Arizona State University
New Technologies for Lighting and Generating Power
Marc Chason, Marc Chason & Associates
Eco-Design - Using Market Drivers to Change the Industry
Wayne Rifer, EPEAT Program
The Challenges and Opportunities in Building a Sustainable Electronics Industry
Carol Handwerker, Purdue University
Intel and the Environment
Hamid Azimi, Intel
The Sustainable Journey at Rohm & Haas
Catherine Hunt, Rohm & Haas
Transforming Communications for a Sustainable Planet
Marc Benowitz and Tom Okrasinski, Alcatel-Lucent
Sustainable Innovation and ECOMOTO
Bill Olson, Motorola
iNEMI CALENDARiNEMI WebsiteBe sure to check the iNEMI website regularly for the latest news and information. If you have any comments, questions, suggestions, etc., regarding website content; please contact Cynthia Williams (cwilliams@inemi.org or +1 207-871-1260). For further information on Asian activities, contact Haley Fu (haley.fu@inemi.org) or +86 (21) 58353839. For further information on European activities, contact Grace O'Malley (gomalley@inemi.org).
From the Editor: We hope you will find this Newsletter interesting and informative. Please provide comments to Bob Pfahl at +1 703-834-2083.