Board
Assembly TIG
___Test
Strategy
___Optoelectronic
Soldering Automation
___Fiber
Optic Splice Improvement
___DPMO
(Defective Parts per Million Opportunities)
New initiatives:
___Flip Chip & CSP Underfill
Technology (in development)
Environmentally Conscious Electronics (ESE) TIG
___Lead-Free
Hybrid Assembly and Rework
___Tin
Whisker
___Tin
Whisker Modeling
___Lead-Free
Assembly (completed)
Factory
Information Systems (FIS) TIG
___Data
Exchange Convergence (completed)
___Virtual
Factory Information Interchange (completed)
___Plug
& Play Factory (completed)
Optoelectronics
TIG
___Fiber
Optic Signal Performance
___Fiber
Handling (completed)
New initiatives:
___Optoelectronics
for Substrates Study
Substrates
TIG
___High
Frequency Material Effects on HDI Formation
___Advanced
Embedded Passives Technology
New initiatives:
___Integral
Resistor and Capacitors Testing
