Sustainability Summit – Continuing Progress
As reported last month, four proposed projects emerged from the discussions at the September summit held at Motorola:
1. Non-competitive LCAs for ITC products based on a building block approach using assembly emulators
2. PVC replacement alternatives
a. LCA comparing PVC versus PVC-free cables
b. Technical evaluation of alternatives
3. Establish market for post-consumer plastics as feedstock for “green” products (e.g., polycarbonate, ABS)
4. Establish new electronic applications for post-consumer blended plastics (e.g., housings for power supplies)
Please notify Bob Pfahl (bob.pfahl@inemi.org) if you are interested in participating in or championing any of the four proposed projects.
Formation Telecon: Eco-Impact Evaluator for ICT Equipment InitiativeTom Okrasinski (Alcatel-Lucent) and Todd Myers (Cisco) are leading this new initiative and have scheduled a teleconference to begin defining the project. Click here for additional information about the Eco-Impact Evaluator for ICT Equipment Initiative. Anyone interested in this initiative is invited to join the conference call:
PVC Replacement Alternatives InitiativeCall-in numbers:
North America: 1-888-864-0817
International: 1-719-234-7889
Participant passcode: 761614
Scott O’Connell (Dell) led the initial formation teleconference for the PVC Replacement Alternatives Initiative on November 6, and the group is now holding regular teleconferences. Two additional calls are scheduled this month — on December 4 and December 18 — and the team is targeting mid to late February 2009 to have a Statement of Work ready for the iNEMI Technical Committee to review. Click here for additional information and/or contact Jim Arnold at jim.arnold@rissastudios.com.
Call-in numbers:
North America: 1-888-864-0817
International: 1-719-234-7889
Participant passcode: 761614
Board Assembly TIG
Nano-Attach "End-of-Project" Webinar
Wednesday, December 17, 1:00 p.m. EST
This webinar will discuss Phase 1 results of the Nano-Attach Project.
Background
Advances in nanotechnology have enabled the realization of biomimetic-inspired structures (such as emulating a gecko’s foot) that have demonstrated adhesion only with mechanical means, the ability to perform numerous attach-detach operations without performance degradation, and the ability to adhere to virtually any surface type. Most important is the realization of a room-temperature, non-chemical, attachment process using nano-attach technology.
Phase 1
The first phase of the Nano-Attach Project led to the identification of electronic assembly applications that would benefit from nano-attach adhesion techniques and the necessary requirements for their adaptation. Nano-attach technology gaps were identified from the team’s technology benchmarking work.
Webinar agenda:
· Project summary
· Background
· Applications – targeted requirements & technology gaps
· Pre-Phase 2 information
· Applications – proposed
Click here for additional information about this end-of-project webinar.
Pb-Free Nano-Solder "End-of-Project" Webinar
Wednesday, February 4, 1:00 p.m. EST
This webinar will discuss Phase 1 results of the Pb-Free Nano-Solder Project.
Background
This iNEMI research project is investigating the application of nanotechnology to suppress Pb-free solder reflow temperature.Nanotechnology encompasses many diverse disciplines to allow the manipulation of matter at the atomic level, enabling radical new approaches to material property enhancement and synthesis.
Phase 1
The Phase 1 goal was to research and develop a nano-solder paste that could effectively suppress the melting point temperature of Pb-free solders.
Webinar agenda:
· Nanotechnology - review
· Collaborating team members
· What is in the literature
· Basic results/observations
· Technical challenges
· Synopsis of external presentations, degrees and recognitions
Click here for additional information about this end-of-project webinar.
Board & Systems Manufacturing Test TIG
Boundary Scan Adoption Survey Launches this Week
The Boundary Scan Adoption Project has developed an industry survey to gauge the current adoption rate of boundary scan and identify any impediments to widespread use. The online survey will be “live” by the end of the first week of December, and the team is soliciting responses from the PCB perspective (e.g., PCB designers, test engineers, engineering managers, design-for-test consultants, service & support staffs, system architects, test equipment providers, etc.) as well as from IC designers who integrate boundary scan into their products.
We hope you and your colleagues will take the time to respond to the survey. Your input can provide valuable feedback to help improve test implementation and coverage for electronic products. For additional information, and to link to the survey, go to
http://www.inemi.org/cms/projects/test/Boundary_Scan_Survey.html
Medical TIG
Medical TIG Forum at U.S. FDA
The Medical TIG held a forum on November 14 to present recommendations the project teams have developed to help the electronics industry ensure reliability of components used in medical products. This forum was hosted by the U.S. Food and Drug Administration (FDA), White Oak Campus, Maryland, and attracted 34 participants.
Click here to download presentations from the Forum.
The 2009 iNEMI Roadmap is nearing completion as final chapters are being completed, edited and formatted for distribution to iNEMI members. We will be shipping roadmap CDs to members this month, so watch the mail for your copy. Members receive the roadmap three months prior to industry, and we mail them to primary and alternate reps, along with members of the Board of Directors, Technical Committee, PEG, TWG, TIG Chairs and Co-Chairs. Also remember that members can license the roadmap (at no cost) for posting on their internal intranets.
The iNEMI staff would again like to thank all of the members participating in this cycle’s roadmap effort. Although the final numbers are not yet determined, we expect that we will again have a truly international roadmap. We had excellent participation and input from the workshops held in North America, Europe and Asia. This latest roadmap includes 20 TWG chapters and five PEG chapters, with new chapters on solid state illumination, RFID-ILT (item-level tag) and photovoltaics.
Roadmap presentations discussing highlights are presently being planned for a number of venues including APEX 2009 (March 29-April 2, Las Vegas).
The next step will be to start mining the roadmap by conducting gap analyses. The iNEMI Technical Committee will begin the process in January, and the TIGs will be invited to meet at APEX to identify key gaps and develop their individual technical plans and resulting project recommendations.
Asia Collaboration Meeting
December 12, Shanghai
The Asia collaboration meeting will be held December 12 at the Rohm and Haas China R&D Center in Shanghai. The meeting will summarize iNEMI 2008 activities and plan for 2009, review project status and discuss new initiative proposals. We welcome member participation and input. Click here for detailed meeting information and for online registration. Please contact Haley Fu (haley.fu@inemi.org) if you have any questions.
Member Briefings in Asia
With the success of the iNEMI member briefing in September at Motorola, we decided to repeat this format in conjunction with other industry events. Briefings were recently held in Penang, Malaysia and Hsinchu, Taiwan.
The Penang briefing was held November 6, following the IEMT Conference. Jim McElroy, CEO of iNEMI, gave a brief presentation about iNEMI progress and Dr. Haley Fu, Manager of Operations, iNEMI-Asia, discussed iNEMI’s activities in Asia. Approximately 25 people attended the session and took advantage of the networking opportunities.
iNEMI member ITRI (Industrial Technology Research Institute) hosted the November 14 meeting in Hsinchu, following the IMEC Packaging Conference. Bob Pfahl, Vice President of Global Operations for iNEMI, gave a similar presentation to the one held in Penang (updated with results of Intel/iNEMI Symposium). There was also a presentation by Simon Lee (Rohm and Haas), member of iNEMI Asia Steering Committee, on a new project proposal. Approximately 17 people attended the session and took advantage of the networking opportunities. We thank ITRI for their generous support in hosting this event.
At both events iNEMI progress was highlighted in the following areas:
· 2009 Roadmap Workshops held in Asia, Europe, and North America
· Active projects — 21, including six that were recently launched
· Successful industry forums — four held during 2008, with a fifth event going on in parallel with the Taiwan briefing
· iNEMI position papers
· New members — 11 so far this year (ASSET InterTech, Inc.; Corelis; Dell, Inc.; Doosan Corp. Electro Materials BG; Elite Material Co., Ltd.; IHS; Industrial Technology Research Institute (ITRI); IST-Integrated Service Technology, Inc.; ITEQ Corporation; Nan Ya Plastics Corporation; and Test Research, Inc.)
Intel/iNEMI Symposium on Environmentally Friendly Materials
This symposium addressed progress and remaining challenges to eliminate brominated flame retardants (BFRs), chlorinated flame retardants (CFRs) and PVC from electronic products, and the impact this will have on the electronics manufacturing supply chain. More than 100 people from all interested segments of the supply chain participated in this two-day event, held November 11-12 in Shanghai. Representatives from OEM, ODM, EMS, laminate suppliers, connector suppliers, raw material suppliers, other consortia, government agencies, and NGOs engaged in constructive discussion and debate. Real-time translation was provided to help deal with the language barriers.While much progress was evident since the last session sponsored by IPC in January, there are still a number of challenges remaining. The iNEMI Technical Committee will incorporate the findings as plans for new projects are considered.
Presentations from the Symposium on Environmentally Friendly Materials are available on CD for 75 USD. For additional information, go to
http://www.inemi.org/cms/newsroom/Presentations/Intel_Symposium_Nov08.html
iNEMI CALENDAR
Click here for the iNEMI Calendar.
For more detailed information on the above meetings, please contact Linda Anderson-Jessup at +1 703-834-2086 or linda.jessup@iNEMI.org.
TIG/Project teleconferences are too numerous to list, and change frequently. If you are interested in participating in any of these calls, contact the Project/TIG Chair or David Godlewski (+1 717-651-0522, dgodlewski@iNEMI.org).
iNEMI Website
Be sure to check the iNEMI website regularly for the latest news and information. If you have any comments, questions, suggestions, etc., regarding website content; please contact Cynthia Williams (cwilliams@inemi.org or +1 207-871-1260). For further information on Asian activities, contact Haley Fu (haley.fu@inemi.org) or +86 (21) 58353839. For further information on European activities, contact Grace O’Malley (gomalley@inemi.org).
From the Editor: We hope you will find this Newsletter interesting and informative. Please provide comments to Bob Pfahl at +1 703-834-2083.