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Problem statement

• Meeting the wiring density needs of the next generation of packaging technology will require improvements in all areas of organic packaging substrates technology

• A piecemeal approach will not be sufficient

• This program will address each technology area with individual projects

Objectives

• The objective is to develop a system optimized next generation technology that focuses on the following prioritized technology areas to achieve maximized wiring density at minimal cost
  
• Material Set
• Low Cost Lithography / Laser
• Plating
• Inspection and Test
  
• Achieve these results by 2014

Expected output

• New materials, processes, and products that achieve a disruptive improvement in wiring density without increased cost

Click here for more information about other Organic Packaging Substrates Initiatives.

Further information

Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org

Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org