Meeting Overview

The iNEMI Optoelectronics Technology Integration Group (TIG) has scheduled its iNEMI Roadmap gap analysis meeting plus an Optical Device Inspection & Cleaning Program to coincide with the optical communications industry’s conference (March 21-25, 2010, San Diego Convention Center, Room 25C, San Diego, CA); for conference information, go to www.ofcnfoec.org.

The one-day iNEMI meeting is scheduled for Monday, March 22, 2010 at the San Diego Convention Center, San Diego, California.

In addition, the face-to-face meeting scheduled at the San Diego Convention Center will have teleconference abilities, for those project participants who cannot attend in person.

To join the teleconference:
Call-in toll-free number (US/Canada):  1-877-669-3239
Global call-in numbers: https://inemi.webex.com/inemi/globalcallin.php?serviceType=MC&ED=132592712&tollFree=1
Attendee access code:  230 455 17

All meetings are open to anyone interested in attending.

Agenda

10:00 – 10:40 am
Introductions; iNEMI Overview, Focus & Value
Jim McElroy, iNEMI

iNEMI Optical Device Inspection & Cleaning Program:
Program Chair:  Dr. Tatiana Berdinskikh, Celestica
Program Co-Chair:  Beth Coviello, Cisco Systems

This program is a continuation of the iNEMI project “Fiber Optic Connector End-Face Inspection – Phase II.”  The program will be focused on research in the following four project areas:
1.  Investigate Impact of Connector Particle Thickness
2.  Develop Receptacle Lens Cleanliness Inspection Criteria
3.  Investigate Impact of Contamination and Scratches on 40G Optical Signal Transmission
4.  Cleanliness Methodologies for Receptacles and Connectors

10:40 – 11:05 am
Program background and SOW “Optical Device Inspection & Cleaning Program”
Dr. Tatiana Berdinskikh, Celestica International Inc.

11:05 – 11:30
Use of vapor degreaser to clean optoelectronics boards
Harvey Stone, MicroCare Corporation

11:30 – 11:55
Contamination effects on optical performance for short reach 10Gb/s 10Gb/s SFP+ transceivers
Christine Chen, Avago Technologies

11.55 – 12.20 pm
Location of active region of lens-based transmitter without activation of device
Doug Wilson, PVI Systems

12:20 – 1:05
Lunch Break

1:05 – 1:30
Flat lens transceiver contamination and concerns regarding the use of vapor degreasing for cleaning transceivers
Dave Lach, Tellabs

1:30 – 1:55
Cleaning of fiber for high power applications
Dr. Masaru Kobayashi, NTT

1:55 – 2:20
Repeatability of particles and distance using FiberQA on manually
collected images of stub devices using P-5000 probe
Doug Wilson, PVI Systems
 
2:20 – 2:45
Particles thickness measurements, project update
Dave Fisher, Tyco Electronics

2.45 – 3:00
Break

3:00 – 3:25
Case study on cleanliness improvements
Mark Marino, Juniper Networks

3:25 – 3:50
Development of inspection criteria for receptacle modules – Fiber Stub
Prof. Ryo Nagase, Chiba University

3:50 – 4:15
Inspection Cleanliness Standards updates
Matt Brown, JDSU

4:15 – 4:45
iNEMI Optoelectronics TIG / Summary
Jim McElroy, iNEMI
• Project Process Review
• Roadmap:  Discuss industry needs and potential new projects to address those needs
• Project Membership Requirements
• Open Discussion

4:45 – 5:00
Meeting Wrap Up; Next Steps
Dave Godlewski, iNEMI

For further information, contact:
David Godlewski
dgodlewski@inemi.org
+1 717-651-0522