Presentation of AEPT Project Results
January 30, 2003 Agenda
3M – Austin, TX

Start 8:00 am                                                                                      

• Welcome - AEPT Project: Overview, Origin, Participants - Larry Marcanti, Nortel (15 Minutes)
• AEPT Test Vehicles:    TV1, J. Zhou, Delphi    and TV2, R. Sheffield, Nortel (15 minutes each)
• Materials and Board Fabrication:     DuPont, 3M, MacDermid, Merix and Coretec (20 minutes each)

Break 10:00 – 10:15

• Materials and Board Fabrication:     DuPont, 3M, MacDermid, Merix and Coretec (continued)
• OEM Discussion - Emulators and lessons learned - Nortel, Delphi, HP (20 minutes each)

Lunch 12:00 – 1:00

• Component Trimming Session (20 minutes each)
• Laser Trimming, Values Upward – ESI
• Inkjet Trimming and Rework, Values Downward – MicroFab
• Modeling Session
• Overview of Cost Modeling Tool and Availability - Foresight, C. Palesko (40 minutes)
• Neural Net Electrical Modeling - Carlton University (20 minutes)
• CALCE Cost Modeling (20 minutes)
• Question and Answer

Break 3:00 – 3:30

• Infrastructure Going Forward –
• IPC Standards and UL – Dave McGregor, DuPont (15 Minutes)
• NEMI - Developing infrastructure for advanced substrate tech. – Bob Pfahl, Vice President of Operations (15 minutes)
• IPC and NWSC Crane Division - Embedded Passives proposal - Dennis Fritz, MacDermid (15 Min)
• IPC Expo Special Activity - Dennis Fritz, MacDermid (15 minutes)
• Embedded Passive Q/A Session - (45 minutes)
• OEMs, Fabricators, Material Suppliers, Support Teams
• Summary - Key Lessons Learned - Emphasize Reliability - L. Marcanti, Nortel (15 Minutes)

Adjourn 5:30